11 Packaging Development jobs in Hong Kong

About Hasbro

Hasbro is a leading games, IP and toy company whose mission is to create joy and community through the magic of play. With over 164 years of expertise, Hasbro delivers groundbreaking play experiences and reaches over 500 million kids, families and fans around the world, through physical and digital games, video games, toys, licensed consumer products, location-based entertainment, film, TV and more.

Through its franchise-first approach, Hasbro unlocks value from both new and legacy IP, including MAGIC: THE GATHERING, DUNGEONS & DRAGONS, MONOPOLY, HASBRO GAMES, NERF, TRANSFORMERS, PLAY-DOH and PEPPA PIG, as well as premier partner brands. Powered by its portfolio of thousands of iconic marks and a diversified network of partners and subsidiary studios, Hasbro brings fans together wherever they are, from tabletop to screen.

For more than a decade, Hasbro has been consistently recognized for its corporate citizenship, including being named one of the 100 Best Corporate Citizens by 3BL Media, a 2025 JUST Capital Industry Leader, one of the 50 Most Community-Minded Companies in the U.S. by the Civic 50, and a Brand that Matters by Fast Company. For more information, visit or @Hasbro on LinkedIn.

Position Overview:

We are seeking a skilled Packaging Engineer to join our Product Development team in Asia. The successful candidate will be responsible for developing innovative packaging solutions that ensure product integrity, sustainability, and cost-efficiency. This role requires expertise in packaging design, materials, and production processes, as well as strong cross-functional collaboration skills.

Key Responsibilities:

• Develop and implement packaging strategies that align with company goals, ensuring the packaging meets regulatory, safety, and sustainability requirements.
• Design, test, and implement new packaging systems and materials, focusing on product protection, cost reduction, and environmental impact.
• Collaborate with US Packaging R&D, product development, manufacturing, and supply chain teams to ensure packaging is designed for efficient production and optimal product delivery while maintaining marketing and design intent.
• Evaluate and recommend new packaging materials and technologies to improve efficiency, reduce waste, and enhance product quality.

Requirements:

• Bachelor's degree in Engineering, Material Science, Packaging Technology or related field.
• Minimum 3 years of relevant work experience with consumer product manufacturing industry.
• Self-motivated, detail-oriented, well-organized, and a good team player. Having analytical skills and problem-solving mindset is definitely an advantage.
• Good communication and coordination skills
• Excellent command of English and preferably fluent in Cantonese and Mandarin
• Packaging structure design capability via design software programs in 2D & 3D environment. (e.g. Esko ArtiosCAD, Adobe Illustrator & Solidworks)

APAC Recruitment - Talent Acquisition Specialist - Hong Kong | Graduate Hiring (Australia & New Zealand) at Tata Consultancy Services

Key Responsibilities:

• Package applications using tool Advanced installer and Expertise in MSI repackaging
• Knowledge in SCCM and Intune for App integration
• Strong knowledge in Batch and PowerShell scripting
• Collaborate with developers, testers, and IT teams to gather requirements and ensure compatibility
• Troubleshoot and remediate packaging issues during testing and deployment
• Maintain documentation of packaging procedures and configurations
• Ensure compliance with security policies and desktop standards
• Provide technical support for packaged applications and deployment issues
• Participate in automation initiatives to streamline packaging workflows

• Mid-Senior level

• Full-time

• Information Technology

• IT Services and IT Consulting

Get notified about new Application Support Engineer jobs in Hong Kong, Hong Kong SAR .

Key Responsibilities:

• Package applications using tool Advanced installer and Expertise in MSI repackaging
• Knowledge in SCCM and Intune for App integration
• Strong knowledge in Batch and PowerShell scripting
• Collaborate with developers, testers, and IT teams to gather requirements and ensure compatibility
• Troubleshoot and remediate packaging issues during testing and deployment
• Maintain documentation of packaging procedures and configurations
• Ensure compliance with security policies and desktop standards
• Provide technical support for packaged applications and deployment issues
• Participate in automation initiatives to streamline packaging workflows

Key Responsibilities:

• Package applications using tool Advanced installer and Expertise in MSI repackaging
• Knowledge in SCCM and Intune for App integration
• Strong knowledge in Batch and PowerShell scripting
• Collaborate with developers, testers, and IT teams to gather requirements and ensure compatibility
• Troubleshoot and remediate packaging issues during testing and deployment
• Maintain documentation of packaging procedures and configurations
• Ensure compliance with security policies and desktop standards
• Provide technical support for packaged applications and deployment issues
• Participate in automation initiatives to streamline packaging workflows

• Mid-Senior level

• Full-time

• Information Technology

• IT Services and IT Consulting

Get notified about new Application Support Engineer jobs in Hong Kong, Hong Kong SAR .

Full job description

Responsibilities

• Forecasting for finished product and semi base material and inventory
• Handling daily complaint by rooting out cause and implementation of corrective action plan
• Responsible for vendor management
• Monitoring AR and follow up overdue
• Extensive daily communication with overseas office and sales office
• Global customer service level mindset

Requirements

• Degree holder is preferable
• With 3-5 working experience in trim industry
• Excellent command of written & spoken English and Mandarin/Cantonese.
• EKnowledge of printing / paper and textile will be an advantage.xperience in printing products & woven label will be an advantage.
• Requires managerial skill set and global reporting skill set for the position

Job Benefits offered:

• Discretionary Bonus
• Group Medical and Dental Insurance
• Education Allowance
• 5-days work
• Birthday Money

工作類型: 全職, 長工

薪酬: $25,000.00至$30,000.00(每月)

福利:

• 牙科保險
• 有薪年假
• 晉升機會
• 產假
• 醫療保險
• 額外休息日

Work Location: 親身到場

Responsibilities

• Forecasting for finished product and semi base material and inventory
• Handling daily complaint by rooting out cause and implementation of corrective action plan
• Responsible for vendor management
• Monitoring AR and follow up overdue
• Extensive daily communication with overseas office and sales office
• Global customer service level mindset

Requirements

• Degree holder is preferable
• With 3-5 working experience in trim industry
• Excellent command of written & spoken English and Mandarin/Cantonese.
• EKnowledge of printing / paper and textile will be an advantage.xperience in printing products & woven label will be an advantage.
• Requires managerial skill set and global reporting skill set for the position

Job Benefits offered:

• Discretionary Bonus
• Group Medical and Dental Insurance
• Education Allowance
• 5-days work
• Birthday Money

工作類型: 全職, 長工

薪酬: $25,000.00至$35,000.00(每月)

福利:

• 牙科保險
• 有薪年假
• 晉升機會
• 產假
• 醫療保險
• 額外休息日

Work Location: 親身到場

• Develop advanced packaging techniques and processes for the assembly of high density and high performance electronic devices
• Closely working with external customers for technical support and process development

• Closely working with internal R&D and product teams to develop new processes and products

• MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines

• Hand-on experience in various semiconductor assembly equipment is preferred
• Well-trained by DOE tool to construct and conduct Design of experiment (DOE) for various assembly process optimization
• Familiar with the analytical equipment for failure mode analysis such as SEM/EDX, C-SAM, AFM, confocal microscope, surface profiler, high power optical microscope,
• Experience in semiconductor Front-end/ Back-end process development is preferred
• Experience of using ANSYS or ABACUS to build model for stress and thermal simulation is a plus
• Optimistic and positive attitude
• Good communication skill
• Work independently and also a good team player

Attractive salary and fringe benefits package will be offered to the right candidates.

Interested parties please submit your application with cover letter, resume, certificate and transcripts.

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.

• MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
• Hand-on experience in various semiconductor assembly equipment is preferred
• Well-trained by DOE tool to construct and conduct Design of experiment (DOE) for various assembly process optimization
• Familiar with the analytical equipment for failure mode analysis such as SEM/EDX, C-SAM, AFM, confocal microscope, surface profiler, high power optical microscope,
• Experience in semiconductor Front-end/ Back-end process development is preferred
• Experience of using ANSYS or ABACUS to build model for stress and thermal simulation is a plus
• Optimistic and positive attitude
• Good communication skill
• Work independently and also a good team player

Attractive salary and fringe benefits package will be offered to the right candidates.

Interested parties please submit your application with cover letter, resume, certificate and transcripts.

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.

• Develop advanced packaging techniques and processes for the assembly of high density and high performance electronic devices
• Closely working with external customers for technical support and process development
• Closely working with internal R&D and product teams to develop new processes and products

• MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
• Hand-on experience in various semiconductor assembly equipment is preferred
• Well-trained by DOE tool to construct and conduct Design of experiment (DOE) for various assembly process optimization
• Familiar with the analytical equipment for failure mode analysis such as SEM/EDX, C-SAM, AFM, confocal microscope, surface profiler, high power optical microscope,
• Experience in semiconductor Front-end/ Back-end process development is preferred
• Experience of using ANSYS or ABACUS to build model for stress and thermal simulation is a plus
• Optimistic and positive attitude
• Good communication skill
• Work independently and also a good team player

Attractive salary and fringe benefits package will be offered to the right candidates.

Please visit our company website for our company background, products and other useful information.

Website: 

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.